Aluminum Nitride Ceramic

Overview of Aluminum Nitride Ceramic

Aluminum Nitride (AlN) ceramic is an advanced technical ceramic material known for its unique combination of extremely high thermal conductivity and excellent electrical insulation properties. Unlike traditional alumina or beryllium oxide ceramics, AlN offers a thermal conductivity close to that of metals like aluminum and copper, while still acting as a robust electrical insulator. It is typically produced via powder processing and sintering, resulting in a dense, hard, and durable material ideal for demanding thermal management applications.

Features of Aluminum Nitride Ceramic

• High Thermal Conductivity: Possesses a theoretical thermal conductivity of up to 320 W/m·K, with commercial grades typically ranging from 170 to 230 W/m·K, effectively dissipating heat in high-power circuits.
• Excellent Electrical Insulation: Despite its metal-like heat transfer, it maintains a high volume resistivity and dielectric strength, preventing short circuits and ensuring device safety.
• Low Thermal Expansion Coefficient (CTE): Its CTE closely matches that of silicon (Si) and Silicon Carbide (SiC), minimizing thermal stress and improving reliability in semiconductor packaging.
• High Mechanical Strength & Corrosion Resistance: It offers good flexural strength and is resistant to attack from many molten metals and chemicals.
• Non-Toxic: AlN is a safe alternative to Beryllium Oxide (BeO) ceramics, which pose serious health risks during processing and disposal.

Specifications of Aluminum Nitride Ceramic

Property	Unit	Typical Value
Purity	%	>99.5
Color	-	Off-white / Grey
Density	g/cm³	3.26 - 3.30
Thermal Conductivity	W/m·K	170 - 200
Flexural Strength	MPa	>300
Vickers Hardness	GPa	11 - 12
Dielectric Constant	(1 MHz)	8.8 - 9.0
Volume Resistivity	Ohm·cm	>10¹⁴
CTE (20-200°C)	ppm/K	4.2 - 4.6

Note: Custom sizes, metallization (DBC/DPC), and tight tolerances are available upon request.

Applications of Aluminum Nitride Ceramic

• Power Electronics: Substrates for IGBT modules, high-power LEDs, and RF power amplifiers.
• Semiconductor Equipment: Susceptors, heaters, and electrostatic chucks used in wafer processing (etching, CVD).
• Heat Sinks & Spreaders: Thermal management components for laser diodes and high-frequency transistors.
• Automotive & Aerospace: Components for inverters and on-board chargers in electric vehicles (EVs).

Company Introduction

Welcome to Eduloc, a leading global supplier of high-quality ceramic grinding balls. Our product range includes,Mullite Ceramic, Quartz Ceramic, Aluminum Nitride Ceramic, Silicon Nitride Ceramic, Silicon Carbide Ceramic designed for industries such as mining, chemicals, coatings, electronics, and pharmaceuticals. We are committed to providing durable and efficient grinding solutions tailored to our customers' diverse needs. With advanced manufacturing technology and stringent quality control, our ceramic grinding balls excel in wear resistance, corrosion resistance, and thermal stability. Partner with us for reliable products and exceptional service that enhance your production efficiency and reliability.

If you have any questions, please feel free to contact us.

Payment Methods

T/T, Western Union, Paypal, Credit Card etc.

Shipment Methods

By air, by sea, by express, as customers request.

5 FAQs of Aluminum Nitride Ceramic

Q1: How does Aluminum Nitride compare to Alumina (Al₂O₃)?
A1: AlN’s primary advantage is its thermal conductivity (5 to 10 times higher than alumina). While alumina is cheaper and sufficient for general electronics, AlN is essential for high-power density applications where heat dissipation is critical.

Q2: Is Aluminum Nitride difficult to machine?
A2: Yes, as a sintered ceramic, it is very hard. Simple shapes can be produced to near-net shape during forming. For complex features, diamond grinding and laser machining are required post-sintering.

Q3: Can Aluminum Nitride be metallized?
A3: Absolutely. It is commonly metallized using processes like Direct Bond Copper (DBC), Direct Plating Copper (DPC), or thin-film metallization (Ti/Ni/Au/Ag) to allow for soldering and wire bonding.

Q4: Is Aluminum Nitride waterproof or hygroscopic?
A4: Standard AlN can hydrolyze (react with moisture) over a very long period, which may affect reliability. However, for most industrial applications, it is stable. For humid environments, specialized grades with protective coatings are available.

Q5: Why should I choose AlN over Beryllium Oxide (BeO)?
A5: Safety. BeO dust is highly toxic if inhaled. AlN offers comparable or better thermal performance without the associated health and environmental hazards, making it the preferred choice for modern, RoHS-compliant manufacturing.