High-Density Grinding Media Balls for Industrial Applications
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Description
Overview of Low Temperature Sintering Aluminum Nitride Electronic Ceramic Plate
Aluminum Nitride (AlN) ceramic is an advanced technical ceramic material known for its unique combination of extremely high thermal conductivity and excellent electrical insulation properties. Unlike traditional alumina or beryllium oxide ceramics, AlN offers a thermal conductivity close to that of metals like aluminum and copper, while still acting as a robust electrical insulator. It is typically produced via powder processing and sintering, resulting in a dense, hard, and durable material ideal for demanding thermal management applications.
Features of Low Temperature Sintering Aluminum Nitride Electronic Ceramic Plate
High Thermal Conductivity: Possesses a theoretical thermal conductivity of up to 320 W/m·K, with commercial grades typically ranging from 170 to 230 W/m·K, effectively dissipating heat in high-power circuits.
Excellent Electrical Insulation: Despite its metal-like heat transfer, it maintains a high volume resistivity and dielectric strength, preventing short circuits and ensuring device safety.
Low Thermal Expansion Coefficient (CTE): Its CTE closely matches that of silicon (Si) and Silicon Carbide (SiC), minimizing thermal stress and improving reliability in semiconductor packaging.
High Mechanical Strength & Corrosion Resistance: It offers good flexural strength and is resistant to attack from many molten metals and chemicals.
Non-Toxic: AlN is a safe alternative to Beryllium Oxide (BeO) ceramics, which pose serious health risks during processing and disposal.

Specification of Low Temperature Sintering Aluminum Nitride Electronic Ceramic Plate
Low Temperature Level Sintering Light Weight Aluminum Nitride Electronic Ceramic Plate
Trick Includes
This light weight aluminum nitride (AlN) ceramic plate is made using an unique low-temperature sintering procedure. The sintering temperature level remains listed below 1600 ° C, which cuts energy use and manufacturing expenses. It additionally aids maintain the material stable and consistent.
High Thermal Conductivity
The plate provides superb warm transfer– generally between 140 and 170 W/m · K. This makes it optimal for power electronic devices and LED modules that require quickly, trusted cooling.
Solid Electrical Insulation
It gives high electric resistivity and dielectric stamina. These characteristics guarantee safe operation in high-voltage settings without risk of short circuits or break downs.
Good Mechanical Strength
Even at slim densities, the plate continues to be tough and resistant to splitting. Its flexural toughness normally surpasses 300 MPa, supporting long-term reliability popular applications.
Technical Particulars
The primary component is aluminum nitride, with small amounts of sintering help like Y TWO O SIX or CaO to help densification at reduced temperatures. The final density reaches over 98% of academic value. Thermal growth matches well with silicon and gallium arsenide, reducing stress and anxiety during thermal cycling.
Surface surface is smooth, with roughness under 0.5 µm. Requirement density options variety from 0.25 mm to 1.0 mm. Custom-made sizes and shapes are available upon demand.
This ceramic plate works well in hybrid circuits, laser diodes, RF tools, and vehicle electronic devices. Its combination of thermal efficiency, electrical security, and mechanical sturdiness makes it a wise choice for modern-day digital systems that run warm yet have to stay dependable.

Applications of Low Temperature Sintering Aluminum Nitride Electronic Ceramic Plate
Applications of Low Temperature Level Sintering Light Weight Aluminum Nitride Electronic Porcelain Plate
High-Performance Electronics Demand Better Products
Light weight aluminum nitride (AlN) ceramic plates made with reduced temperature sintering offer solid thermal conductivity and outstanding electrical insulation. These functions make them perfect for modern-day electronic systems that run warm yet must stay dependable.
Power Electronics and LED Lights
In power components, warm accumulates quickly. Common materials can not move warmth away swiftly enough. Low temperature level sintered AlN plates draw warmth from chips and spread it evenly. This keeps devices cooler and working longer. LED lights also advantages. Intense, high-power LEDs create a lot of heat in a small room. AlN substratums aid handle that warmth without adding bulk or weight.
RF and Microwave Tools
Radio frequency (RF) components need secure performance under altering temperature levels. AlN’s low thermal expansion matches well with semiconductor products like silicon or gallium arsenide. This minimizes anxiety during heating and cooling cycles. The outcome is less cracks, far better signal high quality, and longer tool life.
Sensing Units and Automotive Electronic Devices
Modern automobiles make use of even more sensing units than ever– specifically in engine control, stopping, and chauffeur support systems. These sensing units encounter rough problems: high heat, vibration, and wetness. AlN ceramic plates shield delicate circuits while taking care of thermal lots. Their effectiveness makes them appropriate for under-the-hood electronic devices that must work dependably for years.
Medical and Industrial Tools
Precision issues in medical imaging and industrial control systems. AlN’s mix of electric isolation and fast warmth transfer sustains portable, high-density circuit styles. Engineers can put parts better together without bothering with overheating or disturbance. This leads to smaller sized, smarter gadgets that still satisfy rigorous safety and security and performance standards.
Company Introduction
Welcome to Eduloc, a leading global supplier of high-quality ceramic grinding balls. Our product range includes,Mullite Ceramic, Quartz Ceramic, Aluminum Nitride Ceramic, Silicon Nitride Ceramic, Silicon Carbide Ceramic designed for industries such as mining, chemicals, coatings, electronics, and pharmaceuticals. We are committed to providing durable and efficient grinding solutions tailored to our customers’ diverse needs. With advanced manufacturing technology and stringent quality control, our ceramic grinding balls excel in wear resistance, corrosion resistance, and thermal stability. Partner with us for reliable products and exceptional service that enhance your production efficiency and reliability.
If you have any questions, please feel free to contact us.
Payment Methods
T/T, Western Union, Paypal, Credit Card etc.
Shipment Methods
By air, by sea, by express, as customers request.


5 FAQs of Low Temperature Sintering Aluminum Nitride Electronic Ceramic Plate
Frequently Asked Questions About Low Temperature Sintering Aluminum Nitride Ceramic Plates
What is low temperature sintering aluminum nitride ceramic?
This material is a special type of electronic ceramic made from aluminum nitride (AlN). It is processed at lower temperatures than traditional methods. The result is a plate with high thermal conductivity, strong electrical insulation, and good mechanical strength.
Why choose low temperature sintering over standard methods?
Standard sintering needs very high temperatures, often above 1800°C. Low temperature sintering happens below 1600°C. This saves energy, reduces production costs, and allows the use of cheaper furnace materials. It also helps control the final microstructure better.
What are the main uses of this ceramic plate?
These plates work well in power electronics, LED lighting, laser diodes, and RF devices. They act as substrates or heat spreaders where fast heat removal and electrical isolation are needed. Their performance stays stable even under heavy thermal loads.
Does low temperature sintering affect performance?
Not if done correctly. With proper sintering aids and process control, the plate keeps high thermal conductivity—often over 150 W/m·K—and excellent dielectric strength. The key is using the right additives and maintaining consistent firing conditions.
Are these plates compatible with standard manufacturing processes?
Yes. They can be metalized using thick-film or thin-film techniques. Common metals like tungsten, molybdenum, or silver can be applied for circuit patterns. The plates also support standard dicing, drilling, and mounting steps used in electronic assembly lines.
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