Overview of Sintered Silicon Carbide Ceramic Plate for Semiconductor High Temperature Use

Silicon Carbide (SiC) ceramic is an advanced engineering material synthesized through the high-temperature reaction of silica sand and carbon. Known for its exceptional hardness and stability, this technical ceramic combines the lightweight properties of ceramics with the thermal performance of metals. Silicon Carbide ceramics exist in various forms, including sintered SiC, reaction-bonded SiC (RBSC), and recrystallized SiC, each offering unique microstructures that deliver outstanding performance in the most demanding industrial environments. With its covalent bond structure, SiC provides remarkable durability that surpasses conventional ceramics and metals in extreme conditions.

Features of Sintered Silicon Carbide Ceramic Plate for Semiconductor High Temperature Use

Exceptional Hardness: Ranks 9.5 on the Mohs scale, second only to diamond, providing superior wear and abrasion resistance

High-Temperature Stability: Maintains mechanical strength up to 1400°C (2550°F) in inert atmospheres and 1600°C in oxidizing environments

Thermal Shock Resistance: Excellent thermal conductivity (120-170 W/m·K) combined with low thermal expansion ensures resistance to rapid temperature changes

Chemical Inertness: Unaffected by most acids, alkalis, and corrosive substances; only attacked by strong oxidizing agents at high temperatures

Outstanding Thermal Conductivity: Four times higher than stainless steel, enabling efficient heat transfer applications

Lightweight Structure: Approximately one-third the density of steel while maintaining superior strength-to-weight ratio

Specification of Sintered Silicon Carbide Ceramic Plate for Semiconductor High Temperature Use

Requirements of Sintered Silicon Carbide Ceramic Plate for Semiconductor High-Temperature Use

Product and Composition

Sintered silicon carbide (SSiC) forms the core of this ceramic plate. It includes over 99% pure silicon carbide without any included binders. The material is made with solid-state sintering, which provides it high thickness and exceptional structural integrity.

Secret Performance Includes

This plate works accurately at temperatures approximately 1600 ° C in inert or vacuum settings. It shows really low thermal growth, which helps maintain shape and size under extreme warm. Its thermal conductivity is high, allowing quick and also heat circulation. The plate also resists thermal shock well, so it will not split when temperature adjustments quickly.

Mechanical Stamina

The sintered framework supplies solid mechanical efficiency. Typical flexural stamina reaches 400– 500 MPa. Firmness is around 2800– 3000 HV, making it extremely resistant to put on and abrasion. These residential properties stay steady also after lengthy direct exposure to heats.

Chemical Resistance

Silicon carbide does not respond quickly with the majority of acids, antacid, or liquified metals. It stays stable in extreme chemical atmospheres typical in semiconductor manufacturing. This makes sure lengthy service life and regular performance.

Dimensional Accuracy

Plates are machined to limited tolerances. Standard density tolerance is ± 0.05 mm. Monotony can be held within ± 0.01 mm depending upon size. Custom-made dimensions and surface area finishes are available to satisfy specific tooling or chamber demands.

Sanitation and Pureness

All plates undergo strict cleaning procedures to get rid of bits and pollutants. Steel contamination degrees are maintained below 50 ppm, which is essential for semiconductor applications where even trace contamination impacts yield.

Applications of Sintered Silicon Carbide Ceramic Plate for Semiconductor High Temperature Use

Applications of Sintered Silicon Carbide Porcelain Plate in High-Temperature Semiconductor Processes

Unrivaled Performance Under Extreme Heat

Sintered silicon carbide (SSiC) ceramic plates manage really heats without shedding shape or toughness. They remain stable also when heated over 1,400 ° C. This makes them ideal for use inside semiconductor manufacturing tools where warm is constant and extreme.

Secret Utilizes in Wafer Processing

These plates are frequently utilized as wafer chucks , susceptors , and shower heads in chemical vapor deposition (CVD) and etching systems. Their thermal conductivity spreads heat uniformly throughout the wafer surface area. This assists produce uniform movie thickness and improves yield. The material also resists warping during rapid home heating and cooling down cycles, which maintains procedures dependable over time.

Resists Wear and Chemical Attack

Semiconductor devices commonly use hostile gases like chlorine or fluorine-based plasmas. SSiC plates stand well to these harsh chemicals. They do not wear away easily and maintain their surface area finish after lengthy exposure. This minimizes fragment contamination– an essential variable in cleanroom settings where also small particles can ruin chips.

Long Life Span, Lower Expenses

Due to the fact that sintered silicon carbide is incredibly tough and long lasting, parts made from it last a lot longer than those made from steels or other porcelains. Fewer replacements imply less downtime and reduced maintenance costs. Devices uptime remains high, which sustains constant production schedules.

Precision Satisfies Dependability

Makers device SSiC plates to limited tolerances. This guarantees ideal fit and positioning inside sensitive tools. Incorporated with exceptional monotony and very little thermal development, these plates supply repeatable efficiency set after set– specifically what modern-day semiconductor fabs need .

Company Introduction

Welcome to Eduloc, a leading global supplier of high-quality ceramic grinding balls. Our product range includes,Mullite Ceramic, Quartz Ceramic, Aluminum Nitride Ceramic, Silicon Nitride Ceramic, Silicon Carbide Ceramic designed for industries such as mining, chemicals, coatings, electronics, and pharmaceuticals. We are committed to providing durable and efficient grinding solutions tailored to our customers’ diverse needs. With advanced manufacturing technology and stringent quality control, our ceramic grinding balls excel in wear resistance, corrosion resistance, and thermal stability. Partner with us for reliable products and exceptional service that enhance your production efficiency and reliability.

If you have any questions, please feel free to contact us.

Payment Methods

T/T, Western Union, Paypal, Credit Card etc.

Shipment Methods

By air, by sea, by express, as customers request.

5 FAQs of Sintered Silicon Carbide Ceramic Plate for Semiconductor High Temperature Use

Frequently Asked Questions: Sintered Silicon Carbide Ceramic Plate for Semiconductor High-Temperature Use

What is a sintered silicon carbide ceramic plate?

A sintered silicon carbide ceramic plate is made by heating fine silicon carbide powder under high pressure and temperature. This process creates a dense, strong material that keeps its shape and performance even at very high temperatures. It is widely used in semiconductor manufacturing equipment.

Why choose sintered silicon carbide for high-temperature applications?

Sintered silicon carbide can handle temperatures up to 1600°C without losing strength. It also resists thermal shock, meaning it won’t crack when heated or cooled quickly. These properties make it ideal for parts inside semiconductor furnaces and other hot zones.

How does it compare to other ceramic materials?

Compared to alumina or quartz, sintered silicon carbide has higher thermal conductivity, better mechanical strength, and lower thermal expansion. This means it transfers heat more evenly and stays stable during rapid temperature changes—critical for precision in semiconductor processes.

Is it resistant to chemicals used in semiconductor production?

Yes. Sintered silicon carbide shows excellent resistance to most acids, alkalis, and plasma environments common in semiconductor fabrication. It does not easily corrode or degrade, which helps maintain clean process conditions and extends part life.

Can the plate be customized for specific equipment?

Absolutely. These plates can be machined to tight tolerances and shaped to fit different chamber designs or wafer handling systems. Custom features like holes, grooves, or mounting points can be added without compromising performance at high temperatures.